Diamond
lapping Compound --- An
Introduction
Whenever a superfine finish is required on metals and on
many non-metallic materials, diamond compounds provide the
only effective answer. Despite improvements to conventional
abrasive products, which in many cases connot compare
economically in the rapid production of the very high
precision finishes often required in industry today . To
meet industry's demands for finer, hard-cutting and
specifically graded abrasives, diamond powders were
introduced. Diamond particles for lapping and polishing
operations can be crushed and accurately graded into a range
of sizes down to 1/10 micron (0.000004 in.) maintaining the
sharpness of its cutting points, will remain many times more
effective, for a longer time than any other abrasive.
To use diamond powder for lapping or polishing, it
has to be mixed with a suitable liquid carrier into a
compound. The carrier must ensure uniform suspension of the
diamond particles and keep them permanently apart, so that
no agglomeration occurs; it must lubricate and cool the
lapping operation effectively; absorb abraded workpiece
material with minimal loss of cutting power; and wherever
appropriate, it must also have the correct viscosity to
adhere to laps in motion. Colouring matter is added to
distinguish between micron sizes. |
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